What is epoxy molding compound?

EMC Epoxy Molding Compound, also known as epoxy resin molding compound, is a powdered molding material made from epoxy resin as the matrix resin, high-performance phenolic resin as the curing agent, silicon powder and other fillers added, and various additives mixed together. More than 90% of plastic packaging (referred to as plastic packaging) materials use EMC. The plastic packaging process uses transfer molding to squeeze EMC into the mold cavity and embed the semiconductor chip inside, while crosslinking and solidifying to form a semiconductor device with a certain structural appearance.